HockPin Precision Engineering Sdn Bhd

HOCKPIN PRECISION ENGINEERING SDN BHD was incorporated in 1982 to service the semiconductor and electronics industries in the northern region of Malaysia. Its primary business activities include the fabrication of high precision tools and dies, precision metal stamping and high precision stamping parts as well as automation machine catering to the expectations of the semiconductor and electronics related industries.

 

Today HOCKPIN PRECISION ENGINEERING SDN BHD has become the only company in Malaysia precision engineering that design, fabricate and test the semiconductor lead-frame stamping tool. Many of our design and engineering staff are trained for several years in Japan. Today we are still working closely with our Japanese counterparts.